README.md
1# HiSpark\_pegasus<a name="EN-US_TOPIC_0000001130176841"></a>
2
3- [Introduction](#section11660541593)
4- [Features](#section12212842173518)
5- [Directory Structure](#section1464106163817)
6- [License Agreement](#section1478215290)
7- [Repositories Involved](#section1371113476307)
8
9## Introduction<a name="section11660541593"></a>
10
11HiSpark\_pegasus \(Hi3861 V100\) is a 2 x 5 cm development board. It is a 2.4 GHz Wi-Fi SoC chip that highly integrates the IEEE 802.11b/g/n baseband and radio frequency \(RF\) circuit. The RF circuit includes modules such as the power amplifier \(PA\), low noise amplifier \(LNA\), RF Balun, antenna switch, and power management. It supports a standard bandwidth of 20 MHz and a narrow bandwidth of 5 MHz or 10 MHz, and provides a maximum rate of 72.2 Mbit/s at the physical layer. The Hi3861 V100 Wi-Fi baseband supports the orthogonal frequency division multiplexing \(OFDM\) technology and is backward compatible with the direct sequence spread spectrum \(DSSS\) and complementary code keying \(CCK\) technologies. It also supports various data rates specified in the IEEE 802.11 b/g/n protocol. Hi3861 V100 integrates the high-performance 32-bit microprocessor, hardware security engine, and various peripheral interfaces. The peripheral interfaces include the Synchronous Peripheral Interface \(SPI\), Universal Asynchronous Receiver & Transmitter \(UART\), the Inter Integrated Circuit \(I2C\), Pulse Width Modulation \(PWM\), General Purpose Input/Output \(GPIO\) interface, and multi-channel Analog to Digital Converter \(ADC\). In addition, Hi3861 V100 supports the high-speed SDIO 2.0 Device interface, with a maximum clock frequency of 50 MHz. This chip has a built-in static random access memory \(SRAM\) and flash memory, so that programs can run independently or run from a flash drive. Hi3861 V100 applies to Internet of Things \(IoT\) devices such as smart home appliances.
12
13The Hi3861 platform software shields the underlying layer from the application layer, providing application programming interfaces \(APIs\) for the application software to implement required functions. The following figure shows the typical system application architecture.
14
15**Figure 1** System application architecture<a name="fig4460722185514"></a>
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19
20This framework consists of the following layers:
21
22- APP layer: represents the application layer. The sample code provided by the SDK is stored in the **app\\demo\\src** directory.
23- API layer: provides common APIs developed based on the SDK.
24- Platform layer: provides a board support package \(BSP\) for the SoC, including the following functions:
25 - Chip and peripheral driver
26 - Operating system
27 - System management
28
29- Service layer: provides application protocol stacks such as Wi-Fi. It is used to send and receive data for upper-layer applications.
30- Third party: provides third-party software libraries for the service layer or application layer.
31
32## Features<a name="section12212842173518"></a>
33
34**Stable and reliable communication capability**
35
36- Reliable communication algorithms such as TPC, automatic rate, and immunity against weak interference in complex environments
37
38**Flexible networking capability**
39
40- 256-node mesh networking
41- Standard bandwidth \(20 MHz\) and narrow bandwidth \(5 MHz or 10 MHz\) networking
42
43**Comprehensive network support**
44
45- IPv4 and IPv6-compliant networking
46- DHCPv4 and DHCPv6 Client and Server
47- DNS Client
48- mDNS
49- Basic CoAP, MQTT, HTTP and JSON components
50
51**Advanced security engine**
52
53- AES-128 and AES-256 encryption and decryption algorithms
54- HASH-SHA256 and HMAC\_SHA256 algorithms
55- RSA and ECC signature verification algorithms
56- True random number generation, meeting the FIPS140-2 random test standard
57- TLS and DTLS acceleration
58- eFUSE for secure storage, boot, and upgrade
59- Built-in MPU feature for memory isolation
60
61**Open operating system**
62
63- Low power consumption, small memory, high stability, and high real-time performance
64- Flexible protocol support and extension capabilities
65- Interfaces for secondary development
66- Multi-layer development interfaces: operating system adaptation, system diagnosis, link layer, and network layer interfaces
67
68## Directory Structure<a name="section1464106163817"></a>
69
70The root directory of the Hi3861 SDK is **device\\hisilicon\\hispark\_pegasus\\sdk\_liteos**. Its directory structure is as follows:
71
72```
73device/hisilicon/hispark_pegasus/sdk_liteos
74├── app # Application layer code, including the demo program
75├── boot # Flash bootloader code
76├── build # Library, link, and configuration files required for SDK construction
77├── BUILD.gn # GN building script
78├── build_patch.sh # File used for decompressing the U-Boot open-source code package and applying patches
79├── build.sh # Building script for startup, which can be customized using the sh build.sh menuconfig command
80├── components # Files related to the SDK platform
81├── config # SDK system configuration files
82├── config.gni # Configuration files supporting OpenHarmony
83├── factory.mk # Building script of the factory-test version
84├── hm_build.sh # Building script for adapting to OpenHarmony
85├── include # Header files declaring APIs
86├── license # License of the open-source SDK
87├── Makefile # File for building using the make or make all command
88├── non_factory.mk # Building script of the non-factory-test version
89├── platform # Files related to the SDK platform, including the kernel image and driver modules
90├── SConstruct # SCons build script
91├── third_party # Open-source third-party software
92└── tools # Tools provided by the SDK for Linux and Windows systems, including the NV making tool, signature tool, and Menuconfig
93```
94
95## License Agreement<a name="section1478215290"></a>
96
97- The Hi3861 V100 self-developed code uses the HiSilicon copyright notice licensed under the 2.0 version of the Apache License. The license and copyright information can be viewed at the beginning of the code:
98
99```
100 / *Copyright (c) 2020 HiSilicon (Shanghai) Technologies CO., LIMITED.Licensed under the Apache License,* ... * /
101```
102
103- The third-party code used by Hi3861 V100 complies with the open-source license notice delivered with the software version.
104- The generated library files are stored in **build/libs** in the root directory.
105- Some open-source software components may be used in Hi3861 V100. If the licenses applicable to those open-source software components conflict with this Agreement, the former ones shall prevail.
106
107## Repositories Involved<a name="section1371113476307"></a>
108
109**device/hisilicon/hispark\_pegasus**
110
111vendor/hisilicon
112
113
README_zh.md
1# hi3861v100<a name="ZH-CN_TOPIC_0000001130176841"></a>
2
3- [简介](#section11660541593)
4- [特点](#section12212842173518)
5- [目录](#section1464106163817)
6- [许可协议](#section1478215290)
7- [相关仓](#section1371113476307)
8
9## 简介<a name="section11660541593"></a>
10
11Hi3861V100（HiSpark\_pegasus）是一款高度集成的2.4GHz WiFi SoC芯片，集成IEEE 802.11b/g/n基带和RF电路，RF电路包括功率放大器PA、低 噪声放大器LNA、RF balun、天线开关以及电源管理等模块；支持20MHz标准带宽和5MHz/10MHz窄带宽，提供最大72.2Mbit/s 物理层速率。 Hi3861V100 WiFi基带支持正交频分复用（OFDM）技术，并向下兼容直接序列扩频（DSSS）和补码键控（CCK）技术，支 持IEEE 802.11 b/g/n协议的各种数据速率。 Hi3861V100芯片集成高性能32bit微处理器、硬件安全引擎以及丰富的外设接口，外设接口包括SPI、UART、I2C、PWM、 GPIO和多路ADC，同时支持高速SDIO2.0 Device接口，最高时钟可达50MHz；芯片内置SRAM和Flash，可独立运行，并支持 在Flash上运行程序。 Hi3861V100芯片适应于智能家电等物联网智能终端领域。
12
13上海海思Hi3861系列的平台软件对应用层实现了底层屏蔽，并对应用软件直接提供API\(Application Programming Interface\)接口完成相应功能。典型的系统应用架构如下：
14
15**图 1** 系统架构图<a name="fig4460722185514"></a>
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20该框架可以分为以下几个层次：
21
22- APP层：即应用层。SDK提供的代码示例在SDK的代码目录：app\\demo\\src。
23- API层：提供基于SDK开发的通用接口。
24- Platform平台层：提供SOC系统板级支持包，包括如下功能：
25 - 芯片和外围器件驱动
26 - 操作系统
27 - 系统管理
28
29- Service服务层：提供包含WiFi等应用协议栈。用于上层应用软件进行数据收发等操作。
30- 第三方：提供给Service服务层或提供给应用层使用的第三方软件库。
31
32## 特点<a name="section12212842173518"></a>
33
34**稳定、可靠的通信能力**
35
36- 支持复杂环境下 TPC、自动速率、弱干扰免疫等可靠性通信算法
37
38**灵活的组网能力**
39
40- 支持 256 节点 Mesh 组网
41- 支持标准 20M 带宽组网和 5M/10M 窄带组网
42
43**完善的网络支持**
44
45- 支持 IPv4/IPv6 网络功能
46- 支持 DHCPv4/DHCPv6 Client/Server
47- 支持 DNS Client 功能
48- 支持 mDNS 功能
49- 支持 CoAP/MQTT/HTTP/JSON 基础组件
50
51**强大的安全引擎**
52
53- 硬件实现 AES128/256 加解密算法
54- 硬件实现 HASH-SHA256、HMAC\_SHA256 算法
55- 硬件实现 RSA、ECC 签名校验算法
56- 硬件实现真随机数生成，满足 FIPS140-2 随机测试标准
57- 硬件支持 TLS/DTLS 加速
58- 内部集成 EFUSE，支持安全存储、安全启动、安全升级
59- 内部集成 MPU 特性，支持内存隔离特性
60
61**开放的操作系统**
62
63- 丰富的低功耗、小内存、高稳定性、高实时性机制
64- 灵活的协议支撑和扩展能力
65- 二次开发接口
66- 多层级开发接口：操作系统适配接口和系统诊断接口、 链路层接口、网络层接口
67
68## 目录<a name="section1464106163817"></a>
69
70Hi3861的SDK软件包根目录结构所在位置device\\soc\\hisilicon\\hi3861v100\\sdk\_liteos，如下图所示：
71
72```
73device/soc/hisilicon/hi3861v100/sdk_liteos
74├── app # 应用层代码（其中包含demo程序为参考示例）。
75├── boot # Flash bootloader代码。
76├── build # SDK构建所需的库文件、链接文件、配置文件。
77├── BUILD.gn # GN构建脚本
78├── build_patch.sh # 用于解压uboot开源源码包和打patch。
79├── build.sh # 启动编译脚本，同时支持“sh build.sh menuconfig”进行客制化配置。
80├── components # SDK平台相关的组件
81├── config # SDK系统配置文件。
82├── config.gni # 支持OpenHarmony配置文件。
83├── factory.mk # 厂测版本编译脚本。
84├── hm_build.sh # 适配OpenHarmony构建脚本。
85├── include # API头文件存放目录。
86├── license # SDK开源license声明
87├── Makefile # 支持make编译，使用“make”或“make all”启动编译。
88├── non_factory.mk # 非厂测版本编译脚本。
89├── platform # SDK平台相关的文件（包括：内核镜像、驱动模块等）
90├── SConstruct # SCons编译脚本。
91├── third_party # 开源第三方软件目录。
92└── tools # SDK提供的Linux系统和Windows系统上使用的工具（包括：NV制作工具、签名工具、Menuconfig等）。
93```
94
95## 许可协议<a name="section1478215290"></a>
96
97- Hi3861V100自研代码使用基于Apache License Version 2.0许可的hisi版权声明。许可信息和版权信息通常可以在代码开头看到：
98
99```
100 / *Copyright (c) 2020 HiSilicon (Shanghai) Technologies CO., LIMITED.Licensed under the Apache License,* ... * /
101```
102
103- Hi3861V100使用的第三方代码遵循软件版本自带的开源许可声明。
104- 将生成的库文件统一存放于根目录下的build/libs下。
105- Hi3861V100可能会使用一些开源软件组件。如果这些开源软件组件所适用的许可与本协议内容冲突，则以该开源软件组件的许可为准。
106
107## 相关仓<a name="section1371113476307"></a>
108
109[vendor_hisilicon](https://gitee.com/openharmony/vendor_hisilicon)
110
111[device_board_hisilicon](https://gitee.com/openharmony/device_board_hisilicon)
112
113
