1# 2# Generic thermal sysfs drivers configuration 3# 4 5menuconfig THERMAL 6 tristate "Generic Thermal sysfs driver" 7 help 8 Generic Thermal Sysfs driver offers a generic mechanism for 9 thermal management. Usually it's made up of one or more thermal 10 zone and cooling device. 11 Each thermal zone contains its own temperature, trip points, 12 cooling devices. 13 All platforms with ACPI thermal support can use this driver. 14 If you want this support, you should say Y or M here. 15 16if THERMAL 17 18config THERMAL_HWMON 19 bool 20 prompt "Expose thermal sensors as hwmon device" 21 depends on HWMON=y || HWMON=THERMAL 22 default y 23 help 24 In case a sensor is registered with the thermal 25 framework, this option will also register it 26 as a hwmon. The sensor will then have the common 27 hwmon sysfs interface. 28 29 Say 'Y' here if you want all thermal sensors to 30 have hwmon sysfs interface too. 31 32config THERMAL_OF 33 bool 34 prompt "APIs to parse thermal data out of device tree" 35 depends on OF 36 default y 37 help 38 This options provides helpers to add the support to 39 read and parse thermal data definitions out of the 40 device tree blob. 41 42 Say 'Y' here if you need to build thermal infrastructure 43 based on device tree. 44 45config THERMAL_WRITABLE_TRIPS 46 bool "Enable writable trip points" 47 help 48 This option allows the system integrator to choose whether 49 trip temperatures can be changed from userspace. The 50 writable trips need to be specified when setting up the 51 thermal zone but the choice here takes precedence. 52 53 Say 'Y' here if you would like to allow userspace tools to 54 change trip temperatures. 55 56choice 57 prompt "Default Thermal governor" 58 default THERMAL_DEFAULT_GOV_STEP_WISE 59 help 60 This option sets which thermal governor shall be loaded at 61 startup. If in doubt, select 'step_wise'. 62 63config THERMAL_DEFAULT_GOV_STEP_WISE 64 bool "step_wise" 65 select THERMAL_GOV_STEP_WISE 66 help 67 Use the step_wise governor as default. This throttles the 68 devices one step at a time. 69 70config THERMAL_DEFAULT_GOV_FAIR_SHARE 71 bool "fair_share" 72 select THERMAL_GOV_FAIR_SHARE 73 help 74 Use the fair_share governor as default. This throttles the 75 devices based on their 'contribution' to a zone. The 76 contribution should be provided through platform data. 77 78config THERMAL_DEFAULT_GOV_USER_SPACE 79 bool "user_space" 80 select THERMAL_GOV_USER_SPACE 81 help 82 Select this if you want to let the user space manage the 83 platform thermals. 84 85config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 86 bool "power_allocator" 87 select THERMAL_GOV_POWER_ALLOCATOR 88 help 89 Select this if you want to control temperature based on 90 system and device power allocation. This governor can only 91 operate on cooling devices that implement the power API. 92 93endchoice 94 95config THERMAL_GOV_FAIR_SHARE 96 bool "Fair-share thermal governor" 97 help 98 Enable this to manage platform thermals using fair-share governor. 99 100config THERMAL_GOV_STEP_WISE 101 bool "Step_wise thermal governor" 102 help 103 Enable this to manage platform thermals using a simple linear 104 governor. 105 106config THERMAL_GOV_BANG_BANG 107 bool "Bang Bang thermal governor" 108 default n 109 help 110 Enable this to manage platform thermals using bang bang governor. 111 112 Say 'Y' here if you want to use two point temperature regulation 113 used for fans without throttling. Some fan drivers depend on this 114 governor to be enabled (e.g. acerhdf). 115 116config THERMAL_GOV_USER_SPACE 117 bool "User_space thermal governor" 118 help 119 Enable this to let the user space manage the platform thermals. 120 121config THERMAL_GOV_POWER_ALLOCATOR 122 bool "Power allocator thermal governor" 123 help 124 Enable this to manage platform thermals by dynamically 125 allocating and limiting power to devices. 126 127config CPU_THERMAL 128 bool "generic cpu cooling support" 129 depends on CPU_FREQ 130 depends on THERMAL_OF 131 help 132 This implements the generic cpu cooling mechanism through frequency 133 reduction. An ACPI version of this already exists 134 (drivers/acpi/processor_thermal.c). 135 This will be useful for platforms using the generic thermal interface 136 and not the ACPI interface. 137 138 If you want this support, you should say Y here. 139 140config CLOCK_THERMAL 141 bool "Generic clock cooling support" 142 depends on COMMON_CLK 143 depends on PM_OPP 144 help 145 This entry implements the generic clock cooling mechanism through 146 frequency clipping. Typically used to cool off co-processors. The 147 device that is configured to use this cooling mechanism will be 148 controlled to reduce clock frequency whenever temperature is high. 149 150config DEVFREQ_THERMAL 151 bool "Generic device cooling support" 152 depends on PM_DEVFREQ 153 depends on PM_OPP 154 help 155 This implements the generic devfreq cooling mechanism through 156 frequency reduction for devices using devfreq. 157 158 This will throttle the device by limiting the maximum allowed DVFS 159 frequency corresponding to the cooling level. 160 161 In order to use the power extensions of the cooling device, 162 devfreq should use the simple_ondemand governor. 163 164 If you want this support, you should say Y here. 165 166config THERMAL_EMULATION 167 bool "Thermal emulation mode support" 168 help 169 Enable this option to make a emul_temp sysfs node in thermal zone 170 directory to support temperature emulation. With emulation sysfs node, 171 user can manually input temperature and test the different trip 172 threshold behaviour for simulation purpose. 173 174 WARNING: Be careful while enabling this option on production systems, 175 because userland can easily disable the thermal policy by simply 176 flooding this sysfs node with low temperature values. 177 178config HISI_THERMAL 179 tristate "Hisilicon thermal driver" 180 depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST 181 depends on HAS_IOMEM 182 help 183 Enable this to plug hisilicon's thermal sensor driver into the Linux 184 thermal framework. cpufreq is used as the cooling device to throttle 185 CPUs when the passive trip is crossed. 186 187config IMX_THERMAL 188 tristate "Temperature sensor driver for Freescale i.MX SoCs" 189 depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST 190 depends on MFD_SYSCON 191 depends on OF 192 help 193 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 194 It supports one critical trip point and one passive trip point. The 195 cpufreq is used as the cooling device to throttle CPUs when the 196 passive trip is crossed. 197 198config MAX77620_THERMAL 199 tristate "Temperature sensor driver for Maxim MAX77620 PMIC" 200 depends on MFD_MAX77620 201 depends on OF 202 help 203 Support for die junction temperature warning alarm for Maxim 204 Semiconductor PMIC MAX77620 device. Device generates two alarm 205 interrupts when PMIC die temperature cross the threshold of 206 120 degC and 140 degC. 207 208config QORIQ_THERMAL 209 tristate "QorIQ Thermal Monitoring Unit" 210 depends on THERMAL_OF 211 depends on HAS_IOMEM 212 help 213 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms. 214 It supports one critical trip point and one passive trip point. The 215 cpufreq is used as the cooling device to throttle CPUs when the 216 passive trip is crossed. 217 218config SPEAR_THERMAL 219 tristate "SPEAr thermal sensor driver" 220 depends on PLAT_SPEAR || COMPILE_TEST 221 depends on HAS_IOMEM 222 depends on OF 223 help 224 Enable this to plug the SPEAr thermal sensor driver into the Linux 225 thermal framework. 226 227config ROCKCHIP_THERMAL 228 tristate "Rockchip thermal driver" 229 depends on ARCH_ROCKCHIP || COMPILE_TEST 230 depends on RESET_CONTROLLER 231 depends on HAS_IOMEM 232 help 233 Rockchip thermal driver provides support for Temperature sensor 234 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 235 trip point. Cpufreq is used as the cooling device and will throttle 236 CPUs when the Temperature crosses the passive trip point. 237 238config RCAR_THERMAL 239 tristate "Renesas R-Car thermal driver" 240 depends on ARCH_RENESAS || COMPILE_TEST 241 depends on HAS_IOMEM 242 help 243 Enable this to plug the R-Car thermal sensor driver into the Linux 244 thermal framework. 245 246config KIRKWOOD_THERMAL 247 tristate "Temperature sensor on Marvell Kirkwood SoCs" 248 depends on MACH_KIRKWOOD || COMPILE_TEST 249 depends on HAS_IOMEM 250 depends on OF 251 help 252 Support for the Kirkwood thermal sensor driver into the Linux thermal 253 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 254 255config DOVE_THERMAL 256 tristate "Temperature sensor on Marvell Dove SoCs" 257 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 258 depends on HAS_IOMEM 259 depends on OF 260 help 261 Support for the Dove thermal sensor driver in the Linux thermal 262 framework. 263 264config DB8500_THERMAL 265 tristate "DB8500 thermal management" 266 depends on MFD_DB8500_PRCMU 267 default y 268 help 269 Adds DB8500 thermal management implementation according to the thermal 270 management framework. A thermal zone with several trip points will be 271 created. Cooling devices can be bound to the trip points to cool this 272 thermal zone if trip points reached. 273 274config ARMADA_THERMAL 275 tristate "Armada 370/XP thermal management" 276 depends on ARCH_MVEBU || COMPILE_TEST 277 depends on HAS_IOMEM 278 depends on OF 279 help 280 Enable this option if you want to have support for thermal management 281 controller present in Armada 370 and Armada XP SoC. 282 283config DB8500_CPUFREQ_COOLING 284 tristate "DB8500 cpufreq cooling" 285 depends on ARCH_U8500 || COMPILE_TEST 286 depends on HAS_IOMEM 287 depends on CPU_THERMAL 288 default y 289 help 290 Adds DB8500 cpufreq cooling devices, and these cooling devices can be 291 bound to thermal zone trip points. When a trip point reached, the 292 bound cpufreq cooling device turns active to set CPU frequency low to 293 cool down the CPU. 294 295config INTEL_POWERCLAMP 296 tristate "Intel PowerClamp idle injection driver" 297 depends on THERMAL 298 depends on X86 299 depends on CPU_SUP_INTEL 300 help 301 Enable this to enable Intel PowerClamp idle injection driver. This 302 enforce idle time which results in more package C-state residency. The 303 user interface is exposed via generic thermal framework. 304 305config X86_PKG_TEMP_THERMAL 306 tristate "X86 package temperature thermal driver" 307 depends on X86_THERMAL_VECTOR 308 select THERMAL_GOV_USER_SPACE 309 select THERMAL_WRITABLE_TRIPS 310 default m 311 help 312 Enable this to register CPU digital sensor for package temperature as 313 thermal zone. Each package will have its own thermal zone. There are 314 two trip points which can be set by user to get notifications via thermal 315 notification methods. 316 317config INTEL_SOC_DTS_IOSF_CORE 318 tristate 319 depends on X86 && PCI 320 select IOSF_MBI 321 help 322 This is becoming a common feature for Intel SoCs to expose the additional 323 digital temperature sensors (DTSs) using side band interface (IOSF). This 324 implements the common set of helper functions to register, get temperature 325 and get/set thresholds on DTSs. 326 327config INTEL_SOC_DTS_THERMAL 328 tristate "Intel SoCs DTS thermal driver" 329 depends on X86 && PCI 330 select INTEL_SOC_DTS_IOSF_CORE 331 select THERMAL_WRITABLE_TRIPS 332 help 333 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital 334 temperature sensor (DTS). These SoCs have two additional DTSs in 335 addition to DTSs on CPU cores. Each DTS will be registered as a 336 thermal zone. There are two trip points. One of the trip point can 337 be set by user mode programs to get notifications via Linux thermal 338 notification methods.The other trip is a critical trip point, which 339 was set by the driver based on the TJ MAX temperature. 340 341config INTEL_QUARK_DTS_THERMAL 342 tristate "Intel Quark DTS thermal driver" 343 depends on X86_INTEL_QUARK 344 help 345 Enable this to register Intel Quark SoC (e.g. X1000) platform digital 346 temperature sensor (DTS). For X1000 SoC, it has one on-die DTS. 347 The DTS will be registered as a thermal zone. There are two trip points: 348 hot & critical. The critical trip point default value is set by 349 underlying BIOS/Firmware. 350 351menu "ACPI INT340X thermal drivers" 352source drivers/thermal/int340x_thermal/Kconfig 353endmenu 354 355config INTEL_BXT_PMIC_THERMAL 356 tristate "Intel Broxton PMIC thermal driver" 357 depends on X86 && INTEL_SOC_PMIC && REGMAP 358 help 359 Select this driver for Intel Broxton PMIC with ADC channels monitoring 360 system temperature measurements and alerts. 361 This driver is used for monitoring the ADC channels of PMIC and handles 362 the alert trip point interrupts and notifies the thermal framework with 363 the trip point and temperature details of the zone. 364 365config INTEL_PCH_THERMAL 366 tristate "Intel PCH Thermal Reporting Driver" 367 depends on X86 && PCI 368 help 369 Enable this to support thermal reporting on certain intel PCHs. 370 Thermal reporting device will provide temperature reading, 371 programmable trip points and other information. 372 373config MTK_THERMAL 374 tristate "Temperature sensor driver for mediatek SoCs" 375 depends on ARCH_MEDIATEK || COMPILE_TEST 376 depends on HAS_IOMEM 377 depends on NVMEM || NVMEM=n 378 depends on RESET_CONTROLLER 379 default y 380 help 381 Enable this option if you want to have support for thermal management 382 controller present in Mediatek SoCs 383 384menu "Texas Instruments thermal drivers" 385depends on ARCH_HAS_BANDGAP || COMPILE_TEST 386depends on HAS_IOMEM 387source "drivers/thermal/ti-soc-thermal/Kconfig" 388endmenu 389 390menu "Samsung thermal drivers" 391depends on ARCH_EXYNOS || COMPILE_TEST 392source "drivers/thermal/samsung/Kconfig" 393endmenu 394 395menu "STMicroelectronics thermal drivers" 396depends on ARCH_STI && OF 397source "drivers/thermal/st/Kconfig" 398endmenu 399 400config TANGO_THERMAL 401 tristate "Tango thermal management" 402 depends on ARCH_TANGO || COMPILE_TEST 403 help 404 Enable the Tango thermal driver, which supports the primitive 405 temperature sensor embedded in Tango chips since the SMP8758. 406 This sensor only generates a 1-bit signal to indicate whether 407 the die temperature exceeds a programmable threshold. 408 409source "drivers/thermal/tegra/Kconfig" 410 411config QCOM_SPMI_TEMP_ALARM 412 tristate "Qualcomm SPMI PMIC Temperature Alarm" 413 depends on OF && SPMI && IIO 414 select REGMAP_SPMI 415 help 416 This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP) 417 PMIC devices. It shows up in sysfs as a thermal sensor with multiple 418 trip points. The temperature reported by the thermal sensor reflects the 419 real time die temperature if an ADC is present or an estimate of the 420 temperature based upon the over temperature stage value. 421 422config GENERIC_ADC_THERMAL 423 tristate "Generic ADC based thermal sensor" 424 depends on IIO 425 help 426 This enabled a thermal sysfs driver for the temperature sensor 427 which is connected to the General Purpose ADC. The ADC channel 428 is read via IIO framework and the channel information is provided 429 to this driver. This driver reports the temperature by reading ADC 430 channel and converts it to temperature based on lookup table. 431 432menu "Qualcomm thermal drivers" 433depends on (ARCH_QCOM && OF) || COMPILE_TEST 434source "drivers/thermal/qcom/Kconfig" 435endmenu 436 437endif 438