| /Documentation/firmware-guide/acpi/dsd/ |
| D | graph.rst | 46 "X" is the number of the port. An example of such a package would be::
48 Package() { "port@4", "PRT4" }
55 package would be::
57 Package() { "endpoint@0", "EP40" }
68 name followed by a reference in the same package. Such references consist of
69 the remote device reference, the first package entry of the port data extension
70 reference under the device and finally the first package entry of the endpoint
73 Package() { device, "port@X", "endpoint@Y" }
87 Name (_DSD, Package () {
89 Package () {
[all …]
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| D | leds.rst | 28 Under the LED driver device, The first hierarchical data extension package list
42 Name (_DSD, Package () {
44 Package () {
45 Package () { "led@0", LED0 },
46 Package () { "led@1", LED1 },
49 Name (LED0, Package () {
51 Package () {
52 Package () { "reg", 0 },
53 Package () { "flash-max-microamp", 1000000 },
54 Package () { "flash-timeout-us", 200000 },
[all …]
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| D | data-node-references.rst | 45 Name (_DSD, Package () {
47 Package () {
48 Package () { "node@0", "NOD0" },
49 Package () { "node@1", "NOD1" },
52 Name (NOD0, Package() {
54 Package () {
55 Package () { "random-property", 3 },
58 Name (NOD1, Package() {
60 Package () {
61 Package () { "anothernode", "ANOD" },
[all …]
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| /Documentation/x86/ |
| D | topology.rst | 28 the past a socket always contained a single package (see below), but with the
29 advent of Multi Chip Modules (MCM) a socket can hold more than one package. So
39 Package chapter
44 AMD nomenclature for package is 'Node'.
46 Package-related topology information in the kernel:
50 The number of cores in a package. This information is retrieved via CPUID.
54 The number of dies in a package. This information is retrieved via CPUID.
58 The physical ID of the package. This information is retrieved via CPUID
59 and deduced from the APIC IDs of the cores in the package.
63 The logical ID of the package. As we do not trust BIOSes to enumerate the
[all …]
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| /Documentation/devicetree/bindings/net/ |
| D | icplus-ip101ag.txt | 4 - IP101GR (32-pin QFN package)
5 - IP101G (die only, no package)
6 - IP101GA (48-pin LQFP package)
10 - IP101A (48-pin LQFP package)
11 - IP101AH (48-pin LQFP package)
13 Optional properties for the IP101GR (32-pin QFN package):
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| /Documentation/firmware-guide/acpi/ |
| D | gpio-properties.rst | 29 Name (_DSD, Package ()
32 Package ()
34 Package () {"reset-gpios", Package() {^BTH, 1, 1, 0 }},
35 Package () {"shutdown-gpios", Package() {^BTH, 0, 0, 0 }},
42 Package () { "name", Package () { ref, index, pin, active_low }}
67 Package () {
69 Package () {
90 Name (_DSD, Package () {
93 Package () {
94 Package () {"hog-gpio8", "G8PU"}
[all …]
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| D | enumeration.rst | 158 Name (_CID, Package() {
199 Store (Package (6)
303 Name (_DSD, Package ()
306 Package ()
308 Package () {"power-gpios", Package() {^DEV, 0, 0, 0 }},
309 Package () {"irq-gpios", Package() {^DEV, 1, 0, 0 }},
419 _HID and _CID depends on the position of PRP0001 in the _CID return package.
421 return package will be checked first. Also in that case the bus type the device
431 Name (_DSD, Package() {
433 Package () {
[all …]
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| D | DSD-properties-rules.rst | 22 In the ACPI _DSD context it is an element of the sub-package following the
23 generic Device Properties UUID in the _DSD return package as specified in the
27 that can be returned by _DSD in the Device Properties UUID sub-package for a
32 can be returned in the Device Properties UUID sub-package for the device in
|
| D | video_extension.rst | 38 Derived from the _BCL package(see below);
44 the following _BCL package::
48 Return (Package (0x0C)
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| /Documentation/driver-api/thermal/ |
| D | x86_pkg_temperature_thermal.rst | 7 * x86: with package level thermal management
17 Chapter 14.6: PACKAGE LEVEL THERMAL MANAGEMENT
22 This driver register CPU digital temperature package level sensor as a thermal
24 depends on the capability of the package. Once the trip point is violated,
31 Each package will register as a thermal zone under /sys/class/thermal.
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| D | intel_powerclamp.rst | 58 On modern Intel processors (Nehalem or later), package level C-state
69 closed-loop control system can be established that manages package
73 between the actual package level C-state residency ratio and the target idle
123 In terms of dynamics of the idle control system, package level idle
144 also true for the ability of a system to enter package level C-states.
245 thus not able to enter package C- states at the expected ratio. But
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| /Documentation/scsi/ |
| D | bfa.txt | 34 The latest Firmware package for 3.0.2.2 bfa driver can be found at:
38 and then click following respective util package link:
42 v3.0.0.0 Linux Adapter Firmware package for RHEL 6.2, SLES 11SP2
53 and then click following respective util package link
57 v3.0.2.0 Linux Adapter Firmware package for RHEL 6.2, SLES 11SP2
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| /Documentation/filesystems/ |
| D | gfs2.txt | 31 If you are using Fedora, you need to install the gfs2-utils package
32 and, for lock_dlm, you will also need to install the cman package
34 cman has been replaced by the dlm package.
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| /Documentation/devicetree/bindings/clock/ |
| D | silabs,si5351.txt | 8 clocks. Si5351a also has a reduced pin-count package (MSOP10) where only
16 "silabs,si5351a" - Si5351a, QFN20 package
17 "silabs,si5351a-msop" - Si5351a, MSOP10 package
18 "silabs,si5351b" - Si5351b, QFN20 package
19 "silabs,si5351c" - Si5351c, QFN20 package
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| /Documentation/s390/ |
| D | zfcpdump.rst | 16 the s390-tools package) to make the device bootable. The operator of a Linux
38 The zfcpdump directory is defined in the s390-tools package.
44 The s390-tools package version 1.24.0 and above builds an external zfcpdump
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| /Documentation/driver-api/gpio/ |
| D | board.rst | 84 Name (_DSD, Package () {
86 Package () {
87 Package () {
89 Package () {
95 Package () {
97 Package () {^FOO, 3, 0, 0},
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| /Documentation/hwmon/ |
| D | coretemp.rst | 30 inside Intel CPUs. This driver can read both the per-core and per-package
31 temperature using the appropriate sensors. The per-package sensor is new;
33 show the temperature of all cores inside a package under a single device
55 number. For Package temp, this will be "Physical id Y",
56 where Y is the package number.
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| D | tmp103.rst | 22 wafer chip-scale package (WCSP). The TMP103 is capable of reading
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| D | hih6130.rst | 22 The HIH-6130 & HIH-6131 are humidity and temperature sensors in a SO8 package.
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| /Documentation/crypto/ |
| D | descore-readme.txt | 1 Below is the original README file from the descore.shar package.
29 This package was designed with the following goals:
38 To more rapidly understand the code in this package, inspect desSmallFips.i
69 improvements i had suggested to him, this package's
86 this is a very nice package which implements the most important
92 (at some point i may do the same in my package). he also implements
96 fast crypt(3) package from denmark:
114 crack 3.3c package from england:
152 a while later i ran across the great crypt(3) package mentioned above.
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| /Documentation/power/powercap/ |
| D | powercap.rst | 153 "core" and the "uncore" parts of the given CPU package, respectively. All of
156 to be applied (the constraints in the 'package' power zones apply to the whole
158 the given package individually). Since Intel RAPL doesn't provide instantaneous
167 package-0
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| /Documentation/networking/ |
| D | ray_cs.txt | 22 David Hinds pcmcia package. All the command line parameters are
39 Currently, ray_cs is not part of David Hinds card services package,
135 package which parses the 802.11 headers.
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| /Documentation/filesystems/nfs/ |
| D | nfs-rdma.txt | 76 Download the latest package from:
80 Uncompress the package and follow the installation instructions.
89 To build nfs-utils you will need the tcp_wrappers package installed. For
90 more information on this see the package's README and INSTALL files.
92 After building the nfs-utils package, there will be a mount.nfs binary in
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| /Documentation/admin-guide/namespaces/ |
| D | resource-control.rst | 17 package present on most distros editing /etc/cgrules.conf,
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| /Documentation/driver-api/ |
| D | bt8xxgpio.rst | 13 These ports are accessible via 24 pins on the SMD chip package.
21 GPIO pin and solder that to some tiny wire. As the chip package really is tiny
|