Searched +full:dynamic +full:- +full:power +full:- +full:coefficient (Results 1 – 5 of 5) sorted by relevance
| /Documentation/driver-api/thermal/ |
| D | cpu-cooling-api.rst | 22 --------------------------------------------
30 "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
42 the name "thermal-cpufreq-%x" linking it with a device tree node, in
54 This interface function unregisters the "thermal-cpufreq-%x" cooling device.
58 2. Power models
61 The power API registration functions provide a simple power model for
62 CPUs. The current power is calculated as dynamic power (static power isn't
63 supported currently). This power model requires that the operating-points of
70 The dynamic power consumption of a processor depends on many factors.
73 - The time the processor spends running, consuming dynamic power, as
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| D | cpu-idle-cooling.rst | 1 .. SPDX-License-Identifier: GPL-2.0
8 ----------
13 act on a cooling device to mitigate the dissipated power. When the
18 increase even after the dynamic leakage is reduced to its minimum by
20 to the static leakage. The only solution is to power down the
21 component, thus dropping the dynamic and static leakage that will
24 Last but not least, the system can ask for a specific power budget but
25 because of the OPP density, we can only choose an OPP with a power
26 budget lower than the requested one and under-utilize the CPU, thus
27 losing performance. In other words, one OPP under-utilizes the CPU
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| /Documentation/devicetree/bindings/thermal/ |
| D | thermal-idle.yaml | 1 # SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
4 ---
5 $id: http://devicetree.org/schemas/thermal/thermal-idle.yaml#
6 $schema: http://devicetree.org/meta-schemas/core.yaml#
11 - Daniel Lezcano <daniel.lezcano@linaro.org>
22 const: thermal-idle
24 A thermal-idle node describes the idle cooling device properties to
27 '#cooling-cells':
31 the cooling-maps reference. The first cell is the minimum cooling state
34 duration-us:
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| D | thermal-cooling-devices.yaml | 1 # SPDX-License-Identifier: (GPL-2.0)
4 ---
5 $id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml#
6 $schema: http://devicetree.org/meta-schemas/core.yaml#
11 - Amit Kucheria <amitk@kernel.org>
20 - thermal-sensor: device that measures temperature, has SoC-specific bindings
21 - cooling-device: device used to dissipate heat either passively or actively
22 - thermal-zones: a container of the following node types used to describe all
27 There are essentially two ways to provide control on power dissipation:
28 - Passive cooling: by means of regulating device performance. A typical
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| /Documentation/devicetree/bindings/arm/ |
| D | cpus.yaml | 1 # SPDX-License-Identifier: GPL-2.0
3 ---
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
10 - Lorenzo Pieralisi <lorenzo.pieralisi@arm.com>
21 with updates for 32-bit and 64-bit ARM systems provided in this document.
30 - square brackets define bitfields, eg reg[7:0] value of the bitfield in
59 On 32-bit ARM v7 or later systems this property is
68 On ARM v8 64-bit systems this property is required
71 * If cpus node's #address-cells property is set to 2
79 * If cpus node's #address-cells property is set to 1
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