Searched full:die (Results 1 – 25 of 71) sorted by relevance
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| /Documentation/ABI/testing/ |
| D | sysfs-devices-mapping | 6 each dieX file (where X is die number) holds "Segment:Root Bus"
9 For example, on 4-die Xeon platform with up to 6 IIO stacks per
10 die and, therefore, 6 IIO PMON blocks per die, the mapping of
13 $ ls /sys/devices/uncore_iio_0/die*
19 $ tail /sys/devices/uncore_iio_0/die*
31 IIO PMU 0 on die 0 belongs to PCI RP on bus 0x00, domain 0x0000
32 IIO PMU 0 on die 1 belongs to PCI RP on bus 0x40, domain 0x0000
33 IIO PMU 0 on die 2 belongs to PCI RP on bus 0x80, domain 0x0000
34 IIO PMU 0 on die 3 belongs to PCI RP on bus 0xc0, domain 0x0000
41 value that means UPI link number X on die Y is connected to UPI
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| D | sysfs-devices-platform-kunpeng_hccs | 33 information of all HCCS ports under a specified die.
34 The Y in 'dieY' indicates the hardware id of the die on chip who
40 all_linked: (RO) if all enabled ports on this die are
42 linked_full_lane: (RO) if all linked ports on this die are full
45 die.
65 The Y in 'dieY' indicates the hardware id of the die to which
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| D | debugfs-tpmi | 38 Shows the currently active Performance Limit Reasons for die level and the
39 individual CPUs under the die. The contents of this file are sticky, and
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| /Documentation/hwmon/ |
| D | pli1209bc.rst | 69 temp1_input Die temperature.
70 temp1_alarm Die temperature alarm.
71 temp1_max Maximum die temperature.
72 temp1_max_alarm Die temperature high alarm.
73 temp1_crit Critical die temperature.
74 temp1_crit_alarm Die temperature critical alarm.
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| D | bcm54140.rst | 18 its die temperature as well as two analog voltages.
41 temp1_input Die temperature.
42 temp1_min Minimum die temperature.
43 temp1_max Maximum die temperature.
44 temp1_alarm Die temperature alarm.
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| D | xgene-hwmon.rst | 19 - SoC on-die temperature in milli-degree C
30 - SoC on-die temperature (milli-degree C)
32 - An 1 would indicates on-die temperature exceeded threshold
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| D | sy7636a-hwmon.rst | 20 - SoC on-die temperature in milli-degree C
26 - SoC on-die temperature (milli-degree C)
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| D | ina238.rst | 53 temp1_input Die temperature measurement (mC)
54 temp1_max Maximum die temperature threshold (mC)
55 temp1_max_alarm Maximum die temperature alarm
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| D | tps23861.rst | 36 temp1_input IC die temperature
37 temp1_label "Die"
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| D | k10temp.rst | 111 physical temperature like die or case temperature. Instead, it specifies
122 On some AMD CPUs, there is a difference between the die temperature (Tdie) and
132 Core Complex Die (CCD) temperatures. Up to 8 such temperatures are reported
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| D | peci-cputemp.rst | 47 temp1_label "Die"
48 temp1_input Provides current die temperature of the CPU package.
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| /Documentation/devicetree/bindings/thermal/ |
| D | max77620_thermal.txt | 4 die temperature crosses 120C and 140C. These threshold temperatures
6 of die other than just indicating whether temperature is above or
42 PMIC-Die {
48 pmic_die_warn_temp_thresh: hot-die {
54 pmic_die_cirt_temp_thresh: cirtical-die {
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| D | qcom,spmi-temp-alarm.yaml | 15 interrupt signal and status register to identify high PMIC die temperature.
32 - description: ADC channel, which reports chip die temperature
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| /Documentation/admin-guide/pm/ |
| D | intel_uncore_frequency_scaling.rst | 35 There is one directory for each package and die combination as the scope of
36 uncore scaling control is per die in multiple die/package SoCs or per
37 package for single die per package SoCs. The name represents the
39 die 0.
72 The current sysfs interface supports controls at package and die level.
81 controls at package and die level (like systems without TPMI
107 cluster is affected in that package and die. For example: user changes
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| D | intel-speed-select.rst | 103 die-0
107 die-0
128 die-0
132 die-0
147 die-0
176 die-0
202 die-0
247 die-0
346 Enable core-power for a package/die
375 die-0
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| /Documentation/driver-api/ |
| D | hsi.rst | 8 that is optimized for die-level interconnect between an Application Processor
18 commonly prefixed by AC for signals going from the application die to the
19 cellular die and CA for signals going the other way around.
25 | Die | | Die |
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| /Documentation/target/ |
| D | target-export-device | 17 die() { function
31 [ -n "$DEVICE" ] || die "Missing device or file argument"
32 [ -b $DEVICE -o -f $DEVICE ] || die "Invalid device or file: ${DEVICE}"
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| /Documentation/admin-guide/perf/ |
| D | hisi-pmu.rst | 11 (CCL) is made up of 4 cpu cores sharing one L3 cache; each CPU die is
78 - 5'b00001: comes from L3C in this die;
79 - 5'b01000: comes from L3C in the cross-die;
82 - 5'b01111: comes from the cross-die DDR;
92 4. Some HiSilicon SoCs encapsulate multiple CPU and IO dies. Each CPU die
96 CCL/ICL-ID. For I/O die, the ICL-ID is followed by:
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| D | alibaba_pmu.rst | 12 Yitian 710 employs eight DDR5/4 channels, four on each die. Each DDR5 channel
20 sub-channels of the same channel in die 0. And the PMU device of die 1 is
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| /Documentation/devicetree/bindings/iio/adc/ |
| D | ti,palmas-gpadc.yaml | 28 12 internal die temp
29 13 internal die temp
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| /Documentation/locking/ |
| D | ww-mutex-design.rst | 37 and the deadlock handling approach is called Wait-Die. The name is based on
41 and dies. Hence Wait-Die.
44 wounds the transaction holding the lock, requesting it to die.
49 compared to Wait-Die, but is, on the other hand, associated with more work than
50 Wait-Die when recovering from a backoff. Wound-Wait is also a preemptive
72 class also specifies what algorithm to use, Wound-Wait or Wait-Die.
113 The algorithm (Wait-Die vs Wound-Wait) is chosen by using either
114 DEFINE_WW_CLASS() (Wound-Wait) or DEFINE_WD_CLASS() (Wait-Die)
251 different when retrying due to hitting the -EDEADLK die condition) there's
346 (2) For Wait-Die, among waiters with contexts, only the first one can have
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| /Documentation/ABI/stable/ |
| D | sysfs-devices-system-cpu | 34 Description: the CPU die ID of cpuX. Typically it is the hardware platform's
86 Description: internal kernel map of CPUs within the same die.
94 Description: human-readable list of CPUs within the same die.
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| /Documentation/devicetree/bindings/net/ |
| D | icplus-ip101ag.txt | 5 - IP101G (die only, no package)
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| /Documentation/admin-guide/nfs/ |
| D | nfs-client.rst | 124 die()
130 [ $# -lt 2 ] && die
141 die
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| /Documentation/admin-guide/RAS/ |
| D | address-translation.rst | 22 * COD = Cluster-on-Die
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