| /Documentation/firmware-guide/acpi/dsd/ |
| D | graph.rst | 47 "X" is the number of the port. An example of such a package would be::
49 Package() { "port@4", "PRT4" }
56 package would be::
58 Package() { "endpoint@0", "EP40" }
69 name followed by a string reference in the same package. [data-node-ref]::
85 Name (_DSD, Package () {
87 Package () {
88 Package () { "compatible", Package () { "nokia,smia" } },
91 Package () {
92 Package () { "port@0", "PRT0" },
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| D | leds.rst | 24 Under the LED driver device, The first hierarchical data extension package list
38 Name (_DSD, Package () {
40 Package () {
41 Package () { "led@0", LED0 },
42 Package () { "led@1", LED1 },
45 Name (LED0, Package () {
47 Package () {
48 Package () { "reg", 0 },
49 Package () { "flash-max-microamp", 1000000 },
50 Package () { "flash-timeout-us", 200000 },
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| D | data-node-references.rst | 46 Name (_DSD, Package () {
48 Package () {
49 Package () { "node@0", "NOD0" },
50 Package () { "node@1", "NOD1" },
53 Name (NOD0, Package() {
55 Package () {
56 Package () { "reg", 0 },
57 Package () { "random-property", 3 },
60 Name (NOD1, Package() {
62 Package () {
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| D | phy.rst | 61 MAC port, which is linked in the _DSD package via
126 Name (_DSD, Package () {
128 Package () {
129 Package (2) {"phy-mode", "rgmii-id"},
130 Package (2) {"phy-handle", \_SB.MDI0.PHY1}
137 Name (_DSD, Package () {
139 Package () {
140 Package (2) {"phy-mode", "rgmii-id"},
141 Package (2) {"phy-handle", \_SB.MDI0.PHY2}}
153 Name (_DSD, Package () {
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| /Documentation/arch/x86/ |
| D | topology.rst | 28 the past a socket always contained a single package (see below), but with the
29 advent of Multi Chip Modules (MCM) a socket can hold more than one package. So
39 Package chapter
44 Modern systems may also use the term 'Die' for package.
46 AMD nomenclature for package is 'Node'.
48 Package-related topology information in the kernel:
52 The number of threads in a package.
56 The number of cores in a package.
60 The maximum number of dies in a package.
68 The physical ID of the package. This information is retrieved via CPUID
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| /Documentation/wmi/devices/ |
| D | msi-wmi-platform.rst | 23 Description("This class contains the definition of the package used in other classes"),
25 class Package {
30 Description("This class contains the definition of the package used in other classes"),
37 Description("Class used to operate methods on a package"),
43 [WmiMethodId(1), Implemented, read, write, Description("Return the contents of a package")]
44 void GetPackage([out, id(0)] Package Data);
46 [WmiMethodId(2), Implemented, read, write, Description("Set the contents of a package")]
47 void SetPackage([in, id(0)] Package Data);
49 [WmiMethodId(3), Implemented, read, write, Description("Return the contents of a package")]
52 [WmiMethodId(4), Implemented, read, write, Description("Set the contents of a package")]
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| /Documentation/firmware-guide/acpi/ |
| D | intel-pmc-mux.rst | 82 Name (_DSD, Package () {
84 Package() {
85 Package () {"usb2-port-number", 6},
86 Package () {"usb3-port-number", 3},
103 Name (_DSD, Package () {
105 Package() {
106 Package () {"sbu-orientation", "normal"},
107 Package () {"hsl-orientation", "normal"},
127 Name (_DSD, Package () {
129 Package() {
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| D | gpio-properties.rst | 29 Name (_DSD, Package ()
32 Package ()
34 Package () { "reset-gpios", Package () { ^BTH, 1, 1, 0 } },
35 Package () { "shutdown-gpios", Package () { ^BTH, 0, 0, 0 } },
42 Package () { "name", Package () { ref, index, pin, active_low }}
106 Package () {
108 Package () {
135 Name (_DSD, Package () {
138 Package () {
139 Package () { "hog-gpio8", "G8PU" }
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| D | enumeration.rst | 210 Name (_DSD, Package () {
212 Package () {
213 Package () { "interrupt-names", Package () { "default", "alert" } },
238 Name (_CID, Package () {
274 Name (_DSD, Package ()
277 Package ()
279 Package () { "size", 1024 },
280 Package () { "pagesize", 32 },
281 Package () { "address-width", 16 },
340 Name (_DSD, Package ()
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| D | chromeos-acpi-device.rst | 135 Package {
196 Package {
197 Package {
205 Package {
269 Package {
345 A package containing a list of null-terminated ASCII strings, one for each control method
351 Package {
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| /Documentation/devicetree/bindings/net/ |
| D | ethernet-phy-package.yaml | 4 $id: http://devicetree.org/schemas/net/ethernet-phy-package.yaml#
7 title: Ethernet PHY Package Common Properties
15 of the PHY package.
17 Each reg of the PHYs defined in the PHY package node is
23 pattern: "^ethernet-phy-package@[a-f0-9]+$"
29 The base ID number for the PHY package.
30 Commonly the ID of the first PHY in the PHY package.
32 Some PHY in the PHY package might be not defined but
34 anything) hence the PHY package reg might correspond
|
| D | icplus-ip101ag.txt | 4 - IP101GR (32-pin QFN package)
5 - IP101G (die only, no package)
6 - IP101GA (48-pin LQFP package)
10 - IP101A (48-pin LQFP package)
11 - IP101AH (48-pin LQFP package)
13 Optional properties for the IP101GR (32-pin QFN package):
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| D | qcom,qca807x.yaml | 14 Qualcomm QCA8072/5 Ethernet PHY is PHY package of 2 or 5
32 $ref: ethernet-phy-package.yaml#
37 - qcom,qca8072-package
38 - qcom,qca8075-package
40 qcom,package-mode:
42 PHY package can be configured in 3 mode following this table:
141 ethernet-phy-package@0 {
144 compatible = "qcom,qca8075-package";
147 qcom,package-mode = "qsgmii";
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| /Documentation/hwmon/ |
| D | peci-cputemp.rst | 37 Thermal Sensor (DTS) thermal readings of the CPU package and CPU cores that are
48 temp1_input Provides current die temperature of the CPU package.
49 temp1_max Provides thermal control temperature of the CPU package
51 temp1_crit Provides shutdown temperature of the CPU package which
55 the CPU package.
58 temp2_input Provides current temperature of the CPU package scaled
60 temp2_max Provides thermal control temperature of the CPU package
62 temp2_crit Provides shutdown temperature of the CPU package which
66 the CPU package.
70 package which is also known as Fan Temperature target.
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| /Documentation/trace/coresight/ |
| D | ultrasoc-smb.rst | 62 Name(_DSD, Package() { \
65 Package() { \
68 Package() { \
72 Package() {0x8, 0, \_SB.S00.SL11.CL28.F008, 0}, \
73 Package() {0x9, 0, \_SB.S00.SL11.CL29.F009, 0}, \
74 Package() {0xa, 0, \_SB.S00.SL11.CL2A.F010, 0}, \
75 Package() {0xb, 0, \_SB.S00.SL11.CL2B.F011, 0}, \
76 Package() {0xc, 0, \_SB.S00.SL11.CL2C.F012, 0}, \
77 Package() {0xd, 0, \_SB.S00.SL11.CL2D.F013, 0}, \
78 Package() {0xe, 0, \_SB.S00.SL11.CL2E.F014, 0}, \
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| /Documentation/ABI/testing/ |
| D | sysfs-driver-intel-xe-hwmon | 45 Description: RW. Package reactive sustained (PL1) power limit in microwatts.
59 Description: RO. Package default power limit (default TDP setting).
67 Description: RW. Package reactive critical (I1) power limit in microwatts.
69 Package reactive critical (I1) power limit in microwatts is exposed
80 Description: RW. Package reactive critical (I1) power limit in milliamperes.
82 Package reactive critical (I1) power limit in milliamperes is
91 Description: RO. Package energy input of device in microjoules.
99 Description: RW. Package sustained power limit interval (Tau in PL1/Tau) in
108 Description: RO. Package current voltage in millivolt.
|
| /Documentation/driver-api/pldmfw/ |
| D | file-format.rst | 7 A PLDM firmware package is a binary file which contains a header that
8 describes the contents of the firmware package. This includes an initial
9 package header, one or more firmware records, and one or more components
17 | Package Header |
29 | Package Header CRC |
49 Package Header
52 The package header begins with the UUID of the PLDM file format, and
55 component bitmap, and an overall package version.
57 The following diagram provides an overview of the package header::
71 | Package Version Info |
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| D | driver-ops.rst | 26 package data in a record to the device firmware. If the matching record
27 provides package data, ``pldmfw`` will call the ``.send_package_data``
28 function with a pointer to the package data and with the package data
|
| /Documentation/driver-api/thermal/ |
| D | x86_pkg_temperature_thermal.rst | 7 * x86: with package level thermal management
17 Chapter 14.6: PACKAGE LEVEL THERMAL MANAGEMENT
22 This driver register CPU digital temperature package level sensor as a thermal
24 depends on the capability of the package. Once the trip point is violated,
31 Each package will register as a thermal zone under /sys/class/thermal.
|
| /Documentation/admin-guide/pm/ |
| D | intel_uncore_frequency_scaling.rst | 35 There is one directory for each package and die combination as the scope of
36 uncore scaling control is per die in multiple die/package SoCs or per
37 package for single die per package SoCs. The name represents the
38 scope of control. For example: 'package_00_die_00' is for package id 0 and
72 The current sysfs interface supports controls at package and die level.
81 controls at package and die level (like systems without TPMI
98 This attribute is used to get the package id of this instance.
107 cluster is affected in that package and die. For example: user changes
109 directory with the same package id will be updated. In this case user can
|
| D | intel-speed-select.rst | 102 package-0
106 package-1
127 package-0
131 package-1
146 package-0
175 package-0
201 package-0
226 #turbostat -c 0-13 --show Package,Core,CPU,Bzy_MHz -i 1
228 Package Core CPU Bzy_MHz
246 package-0
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| D | intel_idle.rst | 71 [2]_ for the description of ``_CST`` and its output package). Because the
77 package are of the FFH (Functional Fixed Hardware) type, which means that the
79 enter one of them. The return package of that ``_CST`` is then assumed to be
235 .. _intel-idle-core-and-package-idle-states:
237 Core and Package Levels of Idle States
243 level, referred to as "package C-states", covers the entire processor package
252 to enter a specific package C-state at the deeper level. For example, the
258 cases) it gives the processor a license to put the entire package (possibly
260 low-power state referred to as "package ``C3``" (or ``PC3``), which happens if
267 if the conditions for entering the corresponding package C-states are met, so
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| /Documentation/arch/s390/ |
| D | zfcpdump.rst | 16 the s390-tools package) to make the device bootable. The operator of a Linux
38 The zfcpdump directory is defined in the s390-tools package.
44 The s390-tools package version 1.24.0 and above builds an external zfcpdump
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| /Documentation/devicetree/bindings/rtc/ |
| D | epson,rtc7301.yaml | 11 The DG variant is a DIL package, and the SF variant is a flat
12 package.
|
| /Documentation/scsi/ |
| D | bfa.rst | 39 The latest Firmware package for 3.0.2.2 bfa driver can be found at:
43 and then click following respective util package link:
48 v3.0.0.0 Linux Adapter Firmware package for RHEL 6.2, SLES 11SP2
60 and then click following respective util package link
65 v3.0.2.0 Linux Adapter Firmware package for RHEL 6.2, SLES 11SP2
|