1# HiSpark\_pegasus<a name="EN-US_TOPIC_0000001130176841"></a> 2 3- [Introduction](#section11660541593) 4- [Features](#section12212842173518) 5- [Directory Structure](#section1464106163817) 6- [License Agreement](#section1478215290) 7- [Repositories Involved](#section1371113476307) 8 9## Introduction<a name="section11660541593"></a> 10 11HiSpark\_pegasus \(Hi3861 V100\) is a 2 x 5 cm development board. It is a 2.4 GHz Wi-Fi SoC chip that highly integrates the IEEE 802.11b/g/n baseband and radio frequency \(RF\) circuit. The RF circuit includes modules such as the power amplifier \(PA\), low noise amplifier \(LNA\), RF Balun, antenna switch, and power management. It supports a standard bandwidth of 20 MHz and a narrow bandwidth of 5 MHz or 10 MHz, and provides a maximum rate of 72.2 Mbit/s at the physical layer. The Hi3861 V100 Wi-Fi baseband supports the orthogonal frequency division multiplexing \(OFDM\) technology and is backward compatible with the direct sequence spread spectrum \(DSSS\) and complementary code keying \(CCK\) technologies. It also supports various data rates specified in the IEEE 802.11 b/g/n protocol. Hi3861 V100 integrates the high-performance 32-bit microprocessor, hardware security engine, and various peripheral interfaces. The peripheral interfaces include the Synchronous Peripheral Interface \(SPI\), Universal Asynchronous Receiver & Transmitter \(UART\), the Inter Integrated Circuit \(I2C\), Pulse Width Modulation \(PWM\), General Purpose Input/Output \(GPIO\) interface, and multi-channel Analog to Digital Converter \(ADC\). In addition, Hi3861 V100 supports the high-speed SDIO 2.0 Device interface, with a maximum clock frequency of 50 MHz. This chip has a built-in static random access memory \(SRAM\) and flash memory, so that programs can run independently or run from a flash drive. Hi3861 V100 applies to Internet of Things \(IoT\) devices such as smart home appliances. 12 13The Hi3861 platform software shields the underlying layer from the application layer, providing application programming interfaces \(APIs\) for the application software to implement required functions. The following figure shows the typical system application architecture. 14 15**Figure 1** System application architecture<a name="fig4460722185514"></a> 16 17 18 19 20This framework consists of the following layers: 21 22- APP layer: represents the application layer. The sample code provided by the SDK is stored in the **app\\demo\\src** directory. 23- API layer: provides common APIs developed based on the SDK. 24- Platform layer: provides a board support package \(BSP\) for the SoC, including the following functions: 25 - Chip and peripheral driver 26 - Operating system 27 - System management 28 29- Service layer: provides application protocol stacks such as Wi-Fi. It is used to send and receive data for upper-layer applications. 30- Third party: provides third-party software libraries for the service layer or application layer. 31 32## Features<a name="section12212842173518"></a> 33 34**Stable and reliable communication capability** 35 36- Reliable communication algorithms such as TPC, automatic rate, and immunity against weak interference in complex environments 37 38**Flexible networking capability** 39 40- 256-node mesh networking 41- Standard bandwidth \(20 MHz\) and narrow bandwidth \(5 MHz or 10 MHz\) networking 42 43**Comprehensive network support** 44 45- IPv4 and IPv6-compliant networking 46- DHCPv4 and DHCPv6 Client and Server 47- DNS Client 48- mDNS 49- Basic CoAP, MQTT, HTTP and JSON components 50 51**Advanced security engine** 52 53- AES-128 and AES-256 encryption and decryption algorithms 54- HASH-SHA256 and HMAC\_SHA256 algorithms 55- RSA and ECC signature verification algorithms 56- True random number generation, meeting the FIPS140-2 random test standard 57- TLS and DTLS acceleration 58- eFUSE for secure storage, boot, and upgrade 59- Built-in MPU feature for memory isolation 60 61**Open operating system** 62 63- Low power consumption, small memory, high stability, and high real-time performance 64- Flexible protocol support and extension capabilities 65- Interfaces for secondary development 66- Multi-layer development interfaces: operating system adaptation, system diagnosis, link layer, and network layer interfaces 67 68## Directory Structure<a name="section1464106163817"></a> 69 70The root directory of the Hi3861 SDK is **device\\hisilicon\\hispark\_pegasus\\sdk\_liteos**. Its directory structure is as follows: 71 72``` 73device/hisilicon/hispark_pegasus/sdk_liteos 74├── app # Application layer code, including the demo program 75├── boot # Flash bootloader code 76├── build # Library, link, and configuration files required for SDK construction 77├── BUILD.gn # GN building script 78├── build_patch.sh # File used for decompressing the U-Boot open-source code package and applying patches 79├── build.sh # Building script for startup, which can be customized using the sh build.sh menuconfig command 80├── components # Files related to the SDK platform 81├── config # SDK system configuration files 82├── config.gni # Configuration files supporting OpenHarmony 83├── factory.mk # Building script of the factory-test version 84├── hm_build.sh # Building script for adapting to OpenHarmony 85├── include # Header files declaring APIs 86├── license # License of the open-source SDK 87├── Makefile # File for building using the make or make all command 88├── non_factory.mk # Building script of the non-factory-test version 89├── platform # Files related to the SDK platform, including the kernel image and driver modules 90├── SConstruct # SCons build script 91├── third_party # Open-source third-party software 92└── tools # Tools provided by the SDK for Linux and Windows systems, including the NV making tool, signature tool, and Menuconfig 93``` 94 95## License Agreement<a name="section1478215290"></a> 96 97- The Hi3861 V100 self-developed code uses the HiSilicon copyright notice licensed under the 2.0 version of the Apache License. The license and copyright information can be viewed at the beginning of the code: 98 99``` 100 / *Copyright (c) 2020 HiSilicon (Shanghai) Technologies CO., LIMITED.Licensed under the Apache License,* ... * / 101``` 102 103- The third-party code used by Hi3861 V100 complies with the open-source license notice delivered with the software version. 104- The generated library files are stored in **build/libs** in the root directory. 105- Some open-source software components may be used in Hi3861 V100. If the licenses applicable to those open-source software components conflict with this Agreement, the former ones shall prevail. 106 107## Repositories Involved<a name="section1371113476307"></a> 108 109**device/hisilicon/hispark\_pegasus** 110 111vendor/hisilicon 112 113
